1 |
Experimental and Numerical Analysis of A Novel Ceria Based Abrasive Slurry for Interlayer Dielectric Chemical Mechanical Planarization
|
Yun Zhuang
|
53~57
|
0
|
2 |
Process Effect on the RMS Roughness of HfO2 Thin Films Grown by MOMBE
|
고영돈
|
58~66
|
0
|
3 |
Thermal, Tribological, and Removal Rate Characteristics of Pad Conditioning in Copper CMP
|
Hyosang Lee
|
67~72
|
0
|
4 |
Characterization of Silver Saturated-Ge45Te55 Solid Electrolyte Films Incorporated by Nitrogenfor Programmable Metallization Cell Memory Device
|
Soo-Jin Lee
|
73~78
|
0
|
5 |
Physics of the Coefficient of Friction in CMP
|
Len Borucki
|
79~83
|
0
|
6 |
The Structural and Electrical Properties of Bismuth-based Pyrochlore Thin Films for embedded Capacitor Applications
|
Kyeong-Chan Ahn
|
84~88
|
0
|
7 |
The Properties of CuInSe2 Thin Films by DC/RF Magnetron Sputtering and Thermal Evaporation Method
|
Woon-Jo Jeong
|
89~92
|
0
|
8 |
Electric-optical Characteristics of Backlight Unit with LED Light Source in Low Temperature Condition
|
한정민
|
93~96
|
3
|
9 |
Charging and Discharging Characteristics of Electric Double Layer Capacitors used for a Storage Battery of Solar Energy
|
Youl-Moon Sung
|
97~102
|
0
|