Simulation of Encapsulation Process for BGA Type Semi-conducting Microchip
약어 : J. Ind. Eng. Chem.
2003, vol.9, no.2, pp. 188-192 (5 pages)
UCI : G704-000711.2003.9.2.007
발행기관 : 한국공업화학회
1Dongguk University
2Dongguk University
3Dongguk University
4Korea Chemical Co.
5Korea Chemical Co.
6경민대학교
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