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Recently, requirement for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation and growth of copper. The oxide films were made current step and potential step at 30oC in 1.5M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer on the titanium electrode greatly enhances the surface density of copper crystals. For a 50seconds of deposition, the surface roughness of the copper deposit is lower than that of the untreated surface.


Recently, requirement for the ultra thin copper foil increase with smaller and miniaturized electronic components. A study has been made to determine the effect of an electrochemically produced titanium-oxide film on the nucleation and growth of copper. The oxide films were made current step and potential step at 30oC in 1.5M sulfuric acid on pure titanium metal. The formation of a microporous oxide layer on the titanium electrode greatly enhances the surface density of copper crystals. For a 50seconds of deposition, the surface roughness of the copper deposit is lower than that of the untreated surface.