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this paper eficient method for particle removal from silicon wafers by usage of HF and ozone was stud-ied. It was found that at least 0.3 vol% concentration of HF was required for particle removal and removal efficiencyincreased with the application of megasonic in ozonated water. Additional cleaning with minute amount of ammonia(0.01 vol%) after HF/Ozone step showed over 99% in removal eficiency. It is proposed that the superior cleaning efi-ciency of HF-Ozone-ammonia is due to micro-etching of silicon surface and impediment of particle re-adsorption inalkali environment. Compared to SC-1 cleaning method micro roughness has also been slightly improved. Therefore it isexpected that HF-ozone-amonia cleaning method is a viable alternative to the conventional wet cleaning methods.