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Recently, the miniature of electric products such as notebook, cellular-phone etc. is apparently appeared, due to the smaller size of the semiconductor chips. As the size of chip gets smaller, the circuit could be easily damaged by the slightest influence, therefore it is important to investigate the machining quality of μBGA. This paper deals with machining characteristics of the μBGA singulation. The relationships between the singulation force and machining quality of the μBGA singulation are investigated. It is confirmed that machining quality improves as the singulation force decreases.